Electronic engineers are in hunt for semiconductor memory devices to store date and code with built-in security features. For automotive domain there is one such component from Winbond. Winbond has announced its secure flash memory device W75F is now ISO26262 ASIL Grade D safety certified and is compliant with AEC-Q100. W75F is also Common Criteria EAL5+ certified.
This external memory device W75F has one more certification for IOT and smart devices. It is certified with the Security Evaluation Scheme for IoT Platforms (SESIP) scheme for IoT and smart connected devices up to Level 3 with physical attacker.
The advantage of having external flash memory compared to internal flash memory is,you have more freedom to increase the memory space by adding more such devices. Winbond also claims safety rating for the W75F is higher than internal embedded Flash memories.
Winbond claims it is the only flash vendor with the proven capability of designing devices that can bridge the gap between high safety and high security levels without compromising either.
The W75F Secure Memory can be used to store both code and data and help to guard against threats such as replay, rollback, man-in-the-middle, sniffing, side-channel and fault injection attacks.
Winbond started volume production of this device and is offering this chip in 4Mb, 16Mb and 32Mb densities and SOP16, QFN32, and WLCSP packages.
Key specifications and features of the W75F include Secure eXecute-in-Place (XiP), Tamper-resistant, Code and data confidentiality and integrity, Mutual authentication with SoC, Shared memory architecture for multiple domains, 21MB/s secured and authenticated throughput, 100,000 program/erase cycles, 20-year data retention, Single 1.65 to 1.95V supply, 2mA active current, <1μA Power-down and -40°C to +105°C operating range.
Windbond has two more secure flash memory products falling under its family called TrustME. They are W77Q secure Flash memory and W76S Secure Element.