China based SMIC, BIDIMC and ZDG sign JV to build deep node fab

Date: 03/06/2013
China based semiconductor fab services company Semiconductor Manufacturing International Corporation has entered into the Joint Venture Agreement with SMIC Beijing, BIDIMC and ZDG to establish and build semiconductor fab in 45nm and deeper nodes with manufacturing capacity of 35,000 wafers per month. The total investment is estimated to be US$3.59 billion.

SMIC and SMIC Beijing said to contribute 55% of the registered capital in an aggregate amount of US$660 million, ZDG and BIDIMC to contribute 45% of the registered capital in an aggregate amount of US$540 million.