Silicon photonics chip and DSP coupled without external driver
Date: 18/08/2022
Targeting high-speed data communication applications such as 400Gb/s and 800Gb/s pluggable modules and on-board optics, silicon Photonics chipmaker DustPhotonics and MaxLinear demonstrated silicon photonics chipset with integrated lasers directly driven from a DSP without the use of any external driver chip. This solution exceeds all IEEE specifications and consume power within 7W for 400Gb/s speeds.
The Chipset consists of MaxLinear' Keystone Digital Signal Processor and DustPhotonics Carmel Silicon Photonics chip. The external driver-less coupling of these chips save cost and power consumption of optical transceivers.
The DustPhotonics chip using of 1 laser for every 4 channels, features integrated Distributed feedback laser and its Low Loss Laser Coupling technology to couple light into the Photonic Integrated Circuit chip.
TSMC’s 5nm process made MaxLinear Keystone DSP chip can handle Data speeds of 400Gb/s and 800Gb/s and features transceivers, CPO (Co-Packaged Optics) modules and on-board optics at less power consumption. MaxLinear engineers have optimised its integrated drivers for silicon photonics direct-drive.
To share latest market update on optical transceivers: Due to increased IP traffic growth the optical transceiver market is expected to reach US$24.7 billion in 2027, as per latest update from market researcher Yole Group. High data rates of 400G, 600G, 800G is becoming normal across data center infrastructure and in long-haul networks.
“DustPhotonics is focused on enabling best-in-class Silicon Photonics chips to simplify the efforts of transceiver and systems designers,” said Yoel Chetrit, Vice President R&D of DustPhotonics. “Not only can our Carmel chip simplify the overall system design by reducing the total number of lasers to a single laser for 4 channels, but it also eliminates the external driver, which reduces the cost, power and complexity of the overall system.”
“The combination of our Keystone 5nm integrated driver DSPs with DustPhotonics’ silicon photonics demonstrates the significant power and performance advantages achievable with our integrated drivers,” said Drew Guckenberger, Vice President of Optical Interconnect at MaxLinear. “With double-digit year-on-year growth in market demand for 400Gb/s and 800Gb/s transceivers, this integrated solution can create tremendous value for our customers. We look forward to seeing full transceiver deployments in the near future.”
