Wireless module vendor Murata developed Type 1XL high performance Wi-Fi 6 and Bluetooth 5.3 module by using semiconductor chips from NXP Semiconductors. Murata uses its own proprietary packaging and miniaturization technologies in developing highly reliable low power, small form factor wireless modules to connect things to Internet at lesser cost. Measuring 19.1 mm (L) × 16.5 mm (W) × 2.1 mm (H), this module targets IoT, smart home, audio/video/voice, smart TV, and gateway applications which require less power and less space.
“The wireless communication bandwidth is tightening within our homes and offices with more streaming content, such as 4K/8K video, and traffic increase by teleworking and remote video conference calls,” says Akira Sasaki, manager of the IoT Module Department at Murata. “The low cost, space-saving Type 1XL module enables high-speed communication, which significantly improves quality.”
Powered by NXP 88W9098 combo chipset, the ultra-small dual-band module supports IEEE 802.11a/b/g/n/ac/ax 2×2 multi-user, multiple-input, multiple-output (MU-MIMO) and Bluetooth 5.3 Low Energy (LE). The Wi-Fi section of the module supports connectivity up to 1.4x faster than conventional Wi-Fi compatible devices, offering data rates of up to 1200 Mbps. This section also supports the PCIe 3.0 interface with optional support for SDIO 3.0. The Bluetooth 5.3 LE section supports speeds of up to 2 Mbps with a high-speed 4-wire UART interface, optional support for SDIO, and PCM for audio data.
By using specialized hardware mechanisms and algorithms, this new Type 1XL ensures optimal coexistence of two wireless protocols Wi-Fi and Bluetooth for max performance. The module to have a reference antenna design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market.
This module is under mass production.