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Date: 01-11-14

ID card module tech from Infineon support both contact and contactless

Leading ID chip vendor Infineon unveiled a Coil on Module (CoM) package tech for id cards supporting both contact-based as well as contactless interface. Dual Interface cards made using Infineon' tech can use existing equipment and also new contactless supporting equipment to prove the identity. Infineon offering Dual Interface CoM package technology with a wired card antenna, which can be fully integrated in the card material made of polycarbonate. Infineon shared market estimate data from IHS which says the number of Dual Interface cards for government and healthcare will grow between 2013 and 2019 by 22 percent per year compared to an increase of only 14.3 percent for purely contactless cards.

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