DuPont Microcircuit and Component Materials (MCM) and ITRI in Taiwan are collaborating in bringing a new material GreenTape LTCC (Low Temperature Co-fired Ceramics) to market for use in AiP (Antenna in Package) applications as an alternative to existing Print Circuit Board (PCB) options.DuPont Microcircuit and Component Materials (MCM) is a maker of of printable, stretchable, and thermoformable functional inks and pastes. Industrial Technology Research Institute (ITRI) is a research institute which has incubated startups and spinoffs such as UMC and TSMC.
These partners have unveiled a video of the technology at Del Mar Electronics & Manufacturing Show (DMEMS) 2022 held from May 4 to May 5, 2022.
GreenTape LTCC and Argentum conductive pastes are used to form radio frequency components, substrates, and Antenna in Package for Radio Frequency Front End Modules in 5G mmWave small cells/peripherals. Dupont MCM says the LTCC system offers advantages of higher reliability, excellent electrical performance, good thermal conductivity and outstanding environmental resistance.
“We’re honored to collaborate with ITRI to demonstrate the value of DuPont MCM GreenTape LTCC systems for Antenna in Package applications. To achieve better efficiency and lower power consumption in the antenna array and Radio Frequency Front End module, RF circuit design and low loss material with good thermal stability & reliability will be the critical success factors. ITRI has very strong capabilities which include circuit design, LTCC prototyping, system assembly and testing, and RF performance validation. This collaboration successfully showcases DuPont MCM GreenTape LTCC as a perfect material system for Antenna in Package applications,” said Yu-Ling Hsiao, global technology leader, DuPont MCM.
“LTCC delivers both superior environmental tolerance and a high level of design freedom in high frequency applications. It is perfectly suited for use in RF transceiver devices at 5G mmWave band, such as 28GHz and 39GHz,” said Tzong-Ming Lee, ITRI vice president and general director of Material and Chemical Research Laboratories. “Using single material DuPont MCM LTCC GreenTape, we are able to maintain good thermal stability and heat performance while significantly reducing insertion loss. This has opened the door to developing new AiP substrates, reducing size and signal loss.”
In July, DuPont MCM to launch the prototype.