Panasonic Semiconductor has partnered with Taiwan-based semiconductor foundry UMC to design and mass-produce the latest disruptive flash memory alternative resistive RAM (ReRAM).
Panasonic Semiconductor started ReRAM mass production using a 180nm process in 2013, and it's also selling 8-bit microcomputer MN101LR series for low power consumption applications such as in portable healthcare devices. Panasonic says it was the first to test and verify the high reliability of memory arrays by 40nm process.
Both the UMC and Panasonic integrating Panasonic's 40nm ReRAM process technologies with UMC's high-reliability CMOS process technologies. The goal is to finalise a process to integrate ReRAM inside SOC chips replacing embedded flash memory in applications such as ID cards, wearables and IOT devices.
Panasonic said it will ship product samples in 2018 that use the new 40nm process, and claim will be the first to start mass production in the industry. The two companies, PSCS and UMC are willing to share the co-developed ReRAM process platform to other semiconductor manufacturers and suppliers from around the world.
Kazuhiro Koyama, President of Panasonic semiconductor says, "The company will provide a wide range of optimal products that meet customer needs by developing a scaling process platform that will accelerate the market uptake of ReRAM, whose mass production in the industry was started by PSCS." "We are excited to enter into this foundry agreement with Panasonic," said Senior Vice President S.C. Chien from UMC. "The proven reliability, fast cycle times and high yields of our 40nm process will bring a new element of competitiveness to Panasonic's ReRAM, which will result in mutual benefits for both companies as the product gains widespread market adoption. We look forward to working with Panasonic to bring their 40nm ReRAM to high volume production."