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  Date: 08/02/2015

Spansion and XMC joins hands on 3D NAND flash

Memory chip makers are betting big on 3D NAND. TechNavio has forecasted 3D NAND to grow at a compounded annual growth rate of over 180% by 2018. Samsung, SK hynix, Micron and Toshiba are already into building 3-D NAND chips. The latest one is Spansion. Spansion and China based XMCare partnering to develop and produce 3D NAND Flash memory chips.

"The explosion of data created by the rapid growth of the Internet of Things and more advanced automotive systems is placing greater demands on storage technologies. 3D NAND will revolutionize how data will be more efficiently stored in the future," said Ali Pourkeramati, senior vice president of strategic alliances at Spansion.

"Our leading charge trap MirrorBit technology, which we invented over 10 years ago, will be the key advantage for 3D NAND innovation and will provide unparalleled high-performance data storage."

"We are pleased to co-develop 3D NAND technology with Spansion," said Michael Chen, Chief Business Officer of XMC. "XMC will continue to leverage its leading edge manufacturing capabilities, extensive volume production experience with charge trap technology and world-class R&D team in memory expertise. By partnering with Spansion, we are confident to successfully bring innovative 3D NAND technology to market. "

The first 3D NAND devices from this joint partnership are expected to be available in 2017.

 
          
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