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  Date: 24/09/2013

RFMD completes expansion of its packaging facility in China

RFMD has announced completion of expansion of its test, tape and reel, and assembly facility, located in Beijing, China.

In addition to newly qualified internal assembly capacity for power amplifiers (PAs), switch-based products, and antenna control solutions, RFMD is also qualifying advanced flip chip capabilities for its 2G, 3G, and 4G LTE and TD-LTE products.

 
          
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