Date:7th June 2012
SIPI: LCD-panel to LCD-panel interface
Technologies Ltd has announced a new type of point-to-point
high speed interface for use within LCD display panels.
The new Scalable Intra Panel Interface (SIPI) achieves high
data rate, low power use, and reduced interference with
embedded system wireless services for ultra-thin, high pixel
density mobile displays.
Parade says that SIPI is advantageous over the intra panel
interfaces including the mini-LVDS (mini Low Voltage Differential
Signaling) interface. SIPI incorporates an embedded data
clock through use of 8B/10B data encoding instead of relying
on a separate data clock signal. The combination of 8B/10B
encoding and data scrambling reduces Electromagnetic Interference
and Radio Frequency Interference. This addresses the ongoing
challenge of inference with embedded wireless services,
including GPS services.
SIPI was designed to be scalable with microchip technology
by enabling support for decreasing supply voltages as process
geometries continue to shrink in display panel chips. SIPI
is also compatible with Chip-On-Glass (COG) technology,
which panel makers are increasingly adopting to meet the
demands of the thin-and-light mobile system market.
One-wire Auxiliary Status Channel (ASC) that provides back-channel
communication from the source/column driver SIPI receiver
to the TCON is another feature of SIPI. Through its ability
to report the data error rate at the SIPI receiver, ASC
facilitates automatic panel and system-level testing during
manufacturing, as well as system debugging and status checking.
"Parade has maintained leadership in the DisplayPort
(DP) and Embedded DisplayPort (eDP) enabled TCON market,"
explained Jimmy Chiu, executive VP of marketing at Parade
Technologies. "While DP and eDP removed the data bottleneck
between the motherboard GPU and the TCON input, there was
still no optimized solution for the TCON output, especially
for the new higher-resolution, COG panels. Ongoing evaluation
of the SIPI technology with our key panel customers indicates
we have found a promising solution to this problem. We think
this will further enable the high resolution mobile market."
Future Parade TCON chips would feature SIPI as an output
interface and they would be supported by future source/column
driver chips. LCD display panel prototypes incorporating
SIPI are expected to be available in late 2012. LCD panel
makers in Asia are adopting this new SIPI interface.