Date: 5th Apr 2012
Fairchild Semiconductor licenses Infineon's
automotive MOSFET packaging tech
Fairchild Semiconductor licenses Infineon's advanced automotive
MOSFET packaging technology H-PSOF (Heatsink Plastic Small
Outline Flat Lead), a JEDEC standard TO-Leadless (TO-LL)
High-current automotive applications, including battery
management for hybrid vehicles, Electric Power Steering
(EPS), active alternators and other heavy load electrical
systems uses this type of package.
Advantages of TO-Leadless package
· 1st package to enable current capabilities of 300A
· Board space benefits compared to the current D2PAK
package (>20% smaller; 50% lower package height)
The latest MOSFET technologies from Fairchild will be deployed
by the TO-Leadless power package technology and first samples
are expected in 2nd half of 2012 while the production quantities
are made available in mid 2013.
Marion Limmer, vice president of Fairchild's Automotive
Business Unit, said "Building on a long history serving
the automotive industry, Fairchild Semiconductor is leading
the way in addressing the power semiconductor needs of today's
automobile manufacturers. By deploying this TO-Leadless
power package technology, Fairchild is helping designers
leverage the latest low resistance MOSFET technologies,
further expanding our presence in the automotive market".
Jochen Hanebeck, president of the Automotive Division at
Infineon Technologies AG, quoted, "With this agreement,
the automotive industry benefits from a reliable second-source
supplier base for a high-current power device that provides
many benefits in terms of space, efficiency and performance.
As a technology leader in automotive power applications,
Infineon exploits its technical know-how to provide automotive
system suppliers with MOSFETs enabling higher efficiency
and performance while also minimizing the risk associated
with single supplier sourcing".
Further information on the JEDEC standard of the H-PSOF
TO-Leadless package can be found at http://www.jedec.org.
search for MO-299A.pdf