Date:2nd Dec 2011
Agilent signs acquisition agreement with
Agilent Technologies Inc. and Accelicon Technologies have
signed a definitive acquisition agreement.
The transaction, subject to customary closing conditions,
is expected to be completed in 60 to 90 days. Financial
details were not disclosed.
According to Agilent, accurate, verified device models
are critical to reduce R&D design cycles as higher frequencies,
smaller technology nodes, new materials and device layouts
call for more accurate process design kits, so device modeling
continues to be one of the most critical parts of the electronics
"With the addition of Accelicon's innovative technology
and talented team, we look forward to offering our customers
an even broader portfolio of solutions to address their
modeling needs," said Mark Pierpont, vice president
and general manager of Agilent's Software and Modular Solutions
Division. "Combining Agilent's experience in measurement
with the modeling expertise of both companies advances our
goal of providing design teams with the industry's most
complete flow from device modeling to simulation and measurement."
"We are looking forward to joining our team with Agilent's
EEsof group," said Tim K. Smith, Accelicon's CEO. "Leveraging
Agilent's world-class field and engineering resources will
enhance the development and support of Accelicon's modeling
and validation platform. The combined EEsof/Accelicon platform
will be the most comprehensive and advanced offering in
the market today."
The majority of Accelicon's 30 employees are located in
Beijing, China. As a result of this acquisition, Agilent's
device modeling R&D and services will expand in Asia,
a growing region, where many leading foundries reside.