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  Date:2nd Dec 2011

Agilent signs acquisition agreement with Accelicon Technologies

Agilent Technologies Inc. and Accelicon Technologies have signed a definitive acquisition agreement.
The transaction, subject to customary closing conditions, is expected to be completed in 60 to 90 days. Financial details were not disclosed.

According to Agilent, accurate, verified device models are critical to reduce R&D design cycles as higher frequencies, smaller technology nodes, new materials and device layouts call for more accurate process design kits, so device modeling continues to be one of the most critical parts of the electronics design flow.

"With the addition of Accelicon's innovative technology and talented team, we look forward to offering our customers an even broader portfolio of solutions to address their modeling needs," said Mark Pierpont, vice president and general manager of Agilent's Software and Modular Solutions Division. "Combining Agilent's experience in measurement with the modeling expertise of both companies advances our goal of providing design teams with the industry's most complete flow from device modeling to simulation and measurement."

"We are looking forward to joining our team with Agilent's EEsof group," said Tim K. Smith, Accelicon's CEO. "Leveraging Agilent's world-class field and engineering resources will enhance the development and support of Accelicon's modeling and validation platform. The combined EEsof/Accelicon platform will be the most comprehensive and advanced offering in the market today."

The majority of Accelicon's 30 employees are located in Beijing, China. As a result of this acquisition, Agilent's device modeling R&D and services will expand in Asia, a growing region, where many leading foundries reside.


 
          
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