Date:28th Oct 2011
28nm chips from TSMC are in volume shipment
Leading semiconductor fab TSMC has announced that its 28nm
process is in volume production and production wafers have
been shipped to customers. TSMC's 28nm process offering
includes 28nm High Performance (28HP), 28nm High Performance
Low Power (28HPL), 28nm Low Power (28LP), and 28nm High
Performance Mobile Computing (28HPM). Among these technology
offerings, 28HP, 28HPL and 28LP are all in volume production
and 28HPM is expected to be ready for production by the
end of this year.
TSMC has reported growth in customer numbers at 28nm compared
to 40nm. While moving the 28nm to volume production, TSMC
has already made test chips in deeper nodes such as 20nm.
The 14nm chips are expected in 2015, as per some reports.
TSMC is also expected to move to 450-mm wafer in the coming
years. Double pattering and finfets are the ways ahead when
the nodes extend beyond 28nm node semiconductor technology.
FPGA makers Xilinx, Altera, and graphic processor chipmakers
such as AMD, NVIDIA and fabless leader Qualcomm are expected
to be some of the early customers of TSMC in 28nm node.
TSMC has reported 28nm tape-outs for 80 customers
Open Innovation Platform (OIP) is offered by TSMC for its
partners and customers to get on to the band wagon of 28nm
node which will soon land in 20nm node.
It is predicted that 28nm node going to be a game changing
node in semiconductor industry, mainly in FPGA domain. Xilinx
stated in its recent release it has shipped thousands of
Virtex-7 and Kintex-7 FPGAs worldwide, addressing a diverse
set of applications, ranging from high performance defense
RADAR systems and next-generation 200G wired communication
bridges to ultra-high resolution medical imaging equipment
and cutting edge test and measurement equipment.