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  Date:11th Oct 2011

Infineon starts producing power semiconductor chips on 300 mm wafer

Infineon Technologies AG has produced the first chips ("first silicon") on a 300-millimeter size wafer for power semiconductors at the Villach site in Austria. Infineon claims, this makes the first company in the world to succeed in taking this step forward. Infineon says the chips now produced on a 300-millimeter wafer exhibit the same behavior as the power semiconductors made on 200-millimeter wafers - as has been demonstrated by successful application tests using Metal Oxide Semiconductor Field-Effect Transistors (MOSFETs) for High Voltage applications.

"Our engineers' achievement marks a quantum leap in production technology," says Dr. Reinhard Ploss, Operations, Research & Development and Labor Director of Infineon Technologies AG. "Innovation lays the foundation for profitable growth. Innovation secures our edge over the competition."


 
          
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