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  Date: 22nd Jun 2011

JEDEC publishes inspection criteria for microelectronic packages and covers

JEDEC Solid State Technology Association has announced the publication of a significant revision of its standard for Inspection Criteria for Microelectronic Packages and Covers, JESD9B.

The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits/microcircuits. It is applicable for use by the package manufacturer and the microcircuit manufacturer, from incoming inspection of package components through final inspection of the completed microcircuit. JESD9B also supersedes and incorporates a complete rewrite of JESD27, Ceramic Package Specification for Microelectronic Packages. In addition, JESD9B includes all pertinent areas of MIL-STD-883 and Test Method 2009: External Visual, and is meant to be used in conjunction with but not contradict these standards.

JESD9B incorporates new criteria and updates old criteria based upon advancements in the packaging industry and user failure modes history, both increasing criteria where appropriate for increased quality and reducing criteria where appropriate based upon usage history. The standard also includes clear and easy-to-interpret color photos or diagrams for every condition listed.

"The revised standard was made possible by countless hours of collaboration from metal and ceramic package manufacturers, hybrid/microcircuit/semiconductor manufacturers, and space/aerospace/military and commercial users," said Shawn Graham, Chief Operations Officer of VPT, Inc. and Chairman of the JC-13.5 Task Group 134 which updated the standard. "We believe the publication of JESD9B will be welcome news to all manufacturers and users who will benefit from a common reference point for these essential inspection criteria."


 
          
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