Date: 16th Jun 2011
USB SuperSpeed 3.0 integrated devices
shipments to reach 80 Million in 2011
In interfacing external devices to mobile computing devices
the speed matters, so is the growth of devices integrated
with USB3.0, which offers the data transfer rates at the
speeds of 5 Gbps.
Market researcher In-Stat has forecasted nearly 80 million
USB SuperSpeed-enabled devices will ship in 2011. AMD has
integrated SuperSpeed into the core logic chipset. Intel
is expected to follow with its Ivy Bridge chipset in 2012.
Other details from the report include:
More than 3.5 billion USB devices shipped in 2010.
High-speed USB is still the most popular USB interface,
comprising over three-quarters of USB device shipments in
Core logic integration is key to the acceptance of a new
USB specification, because it allows notoriously cost-conscious
PC OEMs to offer it for free.
CE continues to be a key product segment for USB, with digital
still cameras, digital televisions (DTV), set top boxes,
and portable media players (PMP) among the most popular
"Mobile phones are a key driver for USB overall, and
will play a role in the adoption of SuperSpeed USB,"
says Brian O'Rourke, Research Director. "In 2010, USB
was found internally in over 1.2 billion mobile phones,
with high-speed USB dominating. In addition, the number
of USB ports in phones increased to over 100 million units.
The first SuperSpeed USB phones won't hit the market until
late 2013, but they will be accompanied by a new SuperSpeed
connector for phones that will succeed the current micro-USB
port found in today's phones."
To learn more on In-Stat's report visit www.instat.com
If you are VLSI designer and would like to learn benefits
of putting USB3.0 in your next chip read the white paper
titled "SuperSpeed Your SoCs with USB 3.0 IP"
from Synopsys at url http://www.synopsys.com/dw/doc.php/wp/dw_usb3_wp.pdf.
The IP for USB3.0 is available from Synopsys and also from