Date: 22nd Mar 2011
CEA-Leti working on 3D-integration of
passives on semiconductor
CEA-Leti and IPDiA have formed a common lab dedicated to
developing new 3D-integration technologies for passive electronics
components on the mainstream semiconductor material silicon.
Technologies such as these are highly suitable for LED lighting,
healthcare and aerospace which require extreme miniaturization.
The partnership will also work on further miniaturization
of passive components such as resistors, capacitors and
Specifically, the common lab is designed to develop:
1. Very high-end passive components on silicon that will
resist harsh environments
2. Functional sub-mounts for lighting components.
3. Innovative assembly technologies allowing ultra-miniaturization
of future products
IPDiA was founded in 2009 to commercialize innovative 3D
technologies for integrating passive components. The company's
two axes of focus are integrated devices for high brightness
LEDs and integrated passive devices for new medical, industrial,
aerospace and defense markets.
The release also notes CEA-Leti's expertise in 3D technologies
will allow IPDiA to go beyond the third generation of Passive
Integration Connecting Substrate (PICS) components (250nF/mm²),
which are being produced at IPDiA's Caen site, and pursue
the development of a future generation of PICS components
(1µF/mm², then 2µF/mm²) and their
assembly. These products are designed, developed and manufactured
by IPDiA in its production unit.
"The technologies to be developed in the common lab
are one of the corner stones for industrial development
of IPDiA, and our competencies in developing passive components
in silicon will allow us to put a real industrial and independent
offer in place," said Franck Murray, CEO of IPDIA.
"This partnership is also the result of a great human
adventure, a common work between teams from various backgrounds
generating creativity and new ideas."
"This collaboration is fully in line with our strategy,
and more of our technologies will go to market through this
cooperation with a new innovative partner. Through very
complementary competencies, IPDiA and Leti will work at
the forefront of integrated passive components into silicon
interposers," said Leti CEO Laurent Malier. "Moreover,
this cooperation is a solid example of Leti's commitment
to support the emergence of jobs and companies, as we have
worked with IPDiA from their first day."