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   Date: 6th Aug 2010

Cadence lined up its R&D team to deliver on its EDA360 Vision

Cadence sees its role in complete end-product realization not just the semiconductor chip but the end box/equipment, keeping end-market in mind. Cadence calls this market initiative as EDA360. Cadence has announced it will line up research and development (R&D) around System Realization, SoC Realization and Silicon Realization. This means looking more into what the market requires and a kind of binding various product design tools from embedded hardware/software to PCB design to VLSI chip design. On some of the tools Cadence lacks base, it is bridging it through partnership. Cadence has partnered with embedded software vendor Wind River to introduce an integrated verification computing platform.

Cadence says like this: EDA360 enables applications-driven design: the specification, design, integration and verification of complete hardware/software platforms that are ready for application development.

The people to head this marketing game plan: The System and SoC Realization R&D group will be led by Senior Vice President Nimish Modi, while the Silicon Realization R&D group will be led by Senior Vice President Chi-Ping Hsu. The marketing group led by Chief Marketing Officer John Bruggeman will also tightly align functions with these new R&D groups.

"Customer demands are driving a disruptive transformation in design requirements for the entire electronics industry and this shift is creating new growth opportunities for EDA," said Lip-Bu Tan, president and CEO, Cadence. "We are accelerating the execution of our strategy for delivering integrated solutions that address the complex challenges our customers now face. Cadence has a razor-sharp focus on the changing needs of our customers and this organization better positions the company to capitalize on these emerging opportunities."

Here is what Cadence has said in its white paper: Increasingly complex systems-on-chip (SoCs) are enabling sophisticated applications in mobile communications, consumer electronics, medical devices, networking, automotive, and many other markets. But SoC development costs are rapidly rising with complexity and capacity, and are expected to reach $100 million by the 32nm process node. Studies show that much, if not most, of that cost will be embedded software development. Meanwhile, semiconductor companies are increasingly expected to provide some or all of the embedded software stack with their silicon.
Check this link to know more: www.cadence.com/rl/Resources/white_papers/WindRiver_wp.pdf

          
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