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   Date: 4th June 2010

On Semiconductor expands its fab facility at Idaho

ON Semiconductor is investing $11 million worth of production equipment at its 8-inch fab at Pocatello, Idaho to increase the production capacity. Increase in production is expected by end of 2010. This will create more job openings for semiconductor experts in that part of the U.S. ON Semi currently has staff strength of 630 people at this facility taking care of manufacturing and business operations.

"Having weathered the economic storm brought on by the recession, we are now focused on moving forward to address the increased demand and opportunities in the semiconductor market," said Chuck Spinner, ON Semiconductor vice president of eight-inch manufacturing operations at the Pocatello facility. "Expansion in Idaho is part of the company's overall strategy to maximize its in-house manufacturing capabilities to address increased customer demand. This is positive news for our employees, for the Pocatello community, and for our global customers."

ON Semiconductor's Pocatello facility houses eight-inch wafer fab specializing in the manufacture of application specific integrated circuits (ASICs) and standard products for the automotive, medical, industrial and mil/aero markets.

Few days back ON Semiconductor have introduced a new integrated passive device (IPD) process technology called IPD2 featuring a second 5um copper layer to increase on-chip inductor performance. This process helps to save external inductors or such copper wound components in space constraint applications such as portable electronics equipments.

HighQ IPD2 process utilizes advanced 8-inch wafer technology for making devices like baluns, low pass filters, band pass filters and diplexers used in the latest portable and wireless applications.

To know more visit http://www.onsemi.com

          
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