Date: 4th June 2010
On Semiconductor expands its fab facility
ON Semiconductor is investing $11 million worth of production
equipment at its 8-inch fab at Pocatello, Idaho to increase
the production capacity. Increase in production is expected
by end of 2010. This will create more job openings for semiconductor
experts in that part of the U.S. ON Semi currently has staff
strength of 630 people at this facility taking care of manufacturing
and business operations.
"Having weathered the economic storm brought on by
the recession, we are now focused on moving forward to address
the increased demand and opportunities in the semiconductor
market," said Chuck Spinner, ON Semiconductor vice
president of eight-inch manufacturing operations at the
Pocatello facility. "Expansion in Idaho is part of
the company's overall strategy to maximize its in-house
manufacturing capabilities to address increased customer
demand. This is positive news for our employees, for the
Pocatello community, and for our global customers."
ON Semiconductor's Pocatello facility houses eight-inch
wafer fab specializing in the manufacture of application
specific integrated circuits (ASICs) and standard products
for the automotive, medical, industrial and mil/aero markets.
Few days back ON Semiconductor have introduced a new integrated
passive device (IPD) process technology called IPD2 featuring
a second 5um copper layer to increase on-chip inductor performance.
This process helps to save external inductors or such copper
wound components in space constraint applications such as
portable electronics equipments.
HighQ IPD2 process utilizes advanced 8-inch wafer technology
for making devices like baluns, low pass filters, band pass
filters and diplexers used in the latest portable and wireless
To know more visit http://www.onsemi.com