Date: 7th Nov 09
A team formed in Europe to develop capacitors
inside semiconductor chips
Infineon along with 17 companies and research institutes
in the semiconductor and automotive sector are collaborating
to develop Chip-Mounted Capacitors. The research project
is named as "MaxCaps"
Normally innovation in passive electronics components goes
at snail speed compared to semiconductor chip development.
Here comes some good news where the unavoidable electronic
component capacitor can get integrated on semiconductor
The goal of this research team is to integrate capacitor
elements on silicon chips to reduce the number of discrete
capacitors currently mounted on printed circuit boards (PCB)
by up to 30 %. This technology also makes more space available
The portable electronics is the target market for this technology
where real estate on matters a lot.
The material researchers in this team are looking for alternatives
to the silicon dioxide and silicon nitride materials currently
used as dielectrics in chip manufacturing. They are hunting
for material with higher dielectric properties, which can
be easily formed on silicon substrate.
The 17 research partners are makers of chemicals and deposition
equipment, semiconductor manufacturers, system suppliers
to the automotive industry, research institutes, and universities:
Air Liquide (France), Aixtron (Germany), Analog Devices
(Ireland), ASMI (Belgium, France, Finland), Bronkhorst High-Tech
B.V. (Netherlands), CEA-LETI (France), Continental (Germany),
IHP - Innovations for High Performance Microelectronics
/ Leibniz Institut fuer innovative Mikroelektronik (Germany),
IMEC (Belgium), Infineon Technologies (Germany), NXP (Netherlands,
Belgium), Oxford Instruments (UK), R3T (Germany), SAFC Hightech
(UK), STMicroelectronics (France), Eindhoven University
of Technology (Netherlands), Tyndall National Institute
(Ireland), and the University of Helsinki (Finland).