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   Date: 4th May 2010

Infineon and Mitsubishi agree on same package for IGBTs

Infineon and Mitsubishi have agreed to provide IGBT modules in Infineon designed SmartPACKs and SmartPIMs power module packages. Infineon has developed these new packages, what it calls as smart and revolutionary package concept.

Now the power supply designers can have two sources for this package. Mitsubishi agreed to sell its power chips of various ratings (current range: 15A up to 150A, voltage class: 600V and 1200V) in the Smart-1,-2 and -3 housings of Infineon.

Recently Infineon has similar arrangements with Fairchild Semiconductor for its MOSFET packages, where both have agreed to make their power MOSFETs in compatible packages. The Infineon's PowerStage 3x3 or Fairchild MLP 3x3 (Power33) packages are designed to be physically compatible with each other.

With the competition tightening in the power semiconductor market, the power semiconductor vendors have gone for package differentiators but the customer is less benefited by this trend, when they have to find an alternate supplier. This move by Infineon is aimed at answering this issue to some extent.


          
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