Date: 22nd Apr 2010
Infineon and Fairchild Semiconductor to
make their MOSFETs package-compatible
Infineon and Fairchild Semiconductor have agreed to make
their power MOSFETs in compatible packages. The Infineon's
PowerStage 3x3 or Fairchild MLP 3x3 (Power33) packages are
designed to be physically (pin-to-pin and footprint) compatible
with each other.
This ensures the buyer with alternate supplier with similar
packaging when one of the suppliers ends the supply of MOSFETs
and also gives the designer the choice to choose the vendor.
These MOSFETs with packaging compatibility from Infineon
and Fairchild Semiconductor are used in DC-DC converter
applications in the current range from 3A to 20A.
"Standardizing power packages benefits our customers
as we minimize the amount of 'unique' packages available
in the market place, while offering solutions that enhance
performance levels in smaller form factors than the previous
generations," said Richard Kuncic, director and product
line manager Low Voltage MOSFETs at Infineon Technologies.
"Fairchild and Infineon have standardized the pin-out
and have complementing performance levels, offering customers
two sources for their high efficiency design needs in the
computing, telecom and server markets," said John Bendel,
Fairchild's senior vice president of Low Voltage Products.
"This package alignment is staged to deliver performance
leading products in a multi-source, industry standard package."