electronics engineering Herald                                          component selection
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
Processor / MCU / DSP
Memory
Analog
Logic and Interface
PLD / FPGA
Power-supply and Industrial ICs
Automotive ICs
Cellphone ICs
Consumer ICs
Computer ICs
Communication ICs (Data & Analog)
RF / Microwave
Subsystems / Boards
Reference Design
Software / Development kits
Test and Measurement
Discrete
Opto
Passives
Interconnect
Sensors
Batteries
Others

News

Date: 31 Oct 06

NXP's new family of smartcard ICs are thinner than a sheet of paper.

NXP has announced new family of smartcard ICs called SmartMX family, which are only 75 micrometers in thickness. This new record is 50% thinner than the present smartcard ICs.
These chips are developed for e-passport/Visa and such key ID card applications. The thinness helps in to add additional layers of security information and protective layer on smartcards.
This development is in the direction towards ultra thin smartcards and various innovative security and identity applications.

NXP, ST Micro, and Infineon (all Europe based companies) leading the development; in this market of security and identification.

Events
Advertise
Send News
Send Article
Feedback
eeherald.com
India Search
electronic components
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
©2006 Electronics Engineering Herald