12th Feb 09
Ramtron to make its F-RAM chips
using IBM foundry
F-RAM memory pioneer, Ramtron has entered into a foundry
services agreement with IBM. The companies plan to install
Ramtron's F-RAM semiconductor process technology in IBM's
Burlington, Vermont, advanced wafer manufacturing facility.
Once installed, the new foundry supply will serve as a foundation
for the introduction of new and cost effective high-performance
F-RAM semiconductor products.
"We look forward to increased manufacturing capacity
through our foundry relationship with IBM to help meet the
growing demand for Ramtron's unique F-RAM semiconductor
products," said Bob Djokovich, Ramtron COO. "This
new world-class foundry will provide a flexible and cost
effective manufacturing platform for our new product development
initiatives, which will drive new market opportunities for
Ramtron. We have high confidence in IBM Microelectronics
and believe that the addition of their process development
and foundry services will help Ramtron serve the future
needs of F-RAM customers around the world."
"We are pleased to help facilitate the expansion of
Ramtron's F-RAM product offerings," said John DiToro,
vice president, semiconductor manufacturing, IBM Systems
and Technology Group. "The vast array of IP blocks
available through IBM foundry services can provide Ramtron
with a great deal of product development flexibility. We
look forward to working with Ramtron to help the company
reach its manufacturing and product development objectives."
Ramtron expects to generate first production wafers during
2010 on the IBM 0.18-micron wafer manufacturing process.
IBM will become Ramtron's third foundry supplier for its
F-RAM semiconductor products, along with Fujitsu Limited
and Texas Instruments.
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