December 2009
MEMC Electronic
Materials acquire ownership stake in Eversol
GE and
Metso collaborates to resell Metso Device Asset Management
Solution
Tejas
Networks won Deloitte Tech Fast 500 Asia award fourth time
in a row
Ravi Swaminathan
appointed as MD and VP of Sales and Marketing for AMD India
Walden
C. Rhines to present keynote at the International VLSI Conference
in Bangalore
Mentor
received the IPv6 interoperability approval for its Nucleus
V.6 networking stack
Broadcom
reaches settlement in stock options class action lawsuit
SunEdison
and Xcel Energy wins a deal for five photovoltaic solar installations
in New Mexico
QSound
Labs join in the ARM Solution Center for Android
Avaya
completes the acquisition of Nortel Enterprise Solutions
Kyivstar
GSM selects Alcatel-Lucent to power all-IP network transformation
in Ukraine
Eurotech
wins 1.2M USD contract to supply embedded computers
Redbridge
deploy BridgeWave's gigabit multiple wireless links in its
video surveillance system
Infineon
and Fairchild Semiconductor settle patent dispute on power
transistors
PICMG
announced new specifications for CompactPCI and AdvancedMC
Year 2009
is not that bad for memory chip makers and 2010 going to be
even better
40nm 2-Gigabit
DDR3 SDRAM volume production shipment from Elpida
65nm XS
Version 1-Gigabit DDR3 SDRAM from Elpida
Biometric
security solution replaces passwords with the scan of an employee's
palm
Atmel
integrate Immersion's TouchSense touch feedback tech into
its touch devices
PICMG
adopts PICMG 2.30 for cPCI and AMC.4 specification for AdvancedMC
WD and
NEC partnered to raise USB 3.0 standard with new storage interface
tech
Fairchild
Semiconductor's LED driver drives OSRAM's LED products
Rambus
acquire GLT's patents on lighting and optoelectronics tech
Atmel
collaborates with H&D to deliver power efficient embedded
Wi-Fi solution
Not
to miss event on semiconductors; VLSI conf. on Jan 3-7 2010
in Bangalore
High power
three-phase bridge rectifier modules from Microsemi are DSCC
qualified
Sony and
RealD collaborated to offer immersive 3D home entertainment
ST
Micro engages solidly with Indian power semiconductor market
QNX Neutrino
RTOS supports Cavium's OCTEON Plus multi-core processors
Dell'Oro
Group reports high-speed server network soars in the third
quarter 09
Marvell's
ARMADA 1000 SoC won "Best Media Processor System-on-Chip"
Award
EMU In-Home
Display from Rainforest earns ZigBee Smart Energy product
certification
Over 500
million SmartMX security chip shipment from NXP semiconductor
ITM selects
Broadcom's Bluetooth tech for its hands-free car kits
Upgraded
tech from broadcom to enhance bluetooth and Wi-Fi co-existence
in notebooks
UMC presented
new hybrid high-k/metal gate tech for 28nm at 2009 IEDM
Dell'Oro
reports 10% of decline in China mobile infrastructure market
in third quarter 09
Dr. Tinku
Acharya is elevated to IEEE Fellow for his contribution to
image processing
MATLAB;
an essential tool for a serious engineer
Interaction
with Xilinx-India CTO on FPGA design issues and trends
XtremeData
deploy Altera's Stratix IV FPGAs into its dbX Analytics appliances
Digi-Key
to distribute Torex' power ICs
LSI and
Wichita State University launch Center for Storage Networking
Research
Alcatel-Lucent
increased its IP router market share by four percent
Premier
institutes MIT, Carnegie and Purdue joins cybersecurity research
consortium
Battery
less TV remote control from NEC and Soundpower
AMD and
SiSoftware collaborates to develop OpenCL GPGPU benchmark
suite
Elpida
receives "2009 Global Warming Prevention Activity Award"
Sogitec
certified AMD's synchronization modules and 3D graphics accelerators
India's
new solar mission opening a floodgate of opportunities
Mitsubishi
selects ADI's SHARC processor for its automotive digital process
center
AWR incorporates
AMPSA's multimatch amplifier design tech into its microwave
office
Towerstream
deploys BridgeWave's 80 GHz links into its WiMAX backhaul
network
Airspan's
WiMAX products are FCC certified
Panasonic
and SEAS-NVE collaborated to improve house energy usage remotely
Given
Imaging's camera capsules employs Zarlink's wireless RF chip
Broadcom
acquires Dune Networks to get into cloud computing
Epson
Imaging's TFT LCD business sales function transferred to the
Sony Group
e2v's
Centre for Electronic Imaging in collaboration with Open University
Automotive-grade
semiconductor manufacturing by TSMC
Record
level sales of PON equipment according to Dell'Oro report
"Understand
digital power in one day" hands-on technical seminar
by Intersil in Germany
November 2009
Surge
protection devices from Emerson meet UL safety standards without
need for modifications
Emerson
Network Power expands VME board portfolio with new ruggedized
models
MEMS microphones
from ST in the price range of electret microphones
3D Systems
acquires AdvaTech's manufacturing to extend its 3Dproparts
targeting military apps
China
Telecom selects Alcatel-Lucent to deploy first commercial
WAP & WEB Gateway
There
Corporation is new partner of Z-Wave Alliance
AeroScout's
Wi-Fi RFID solution powering Ultimo's hospital software
Infineon
and Nokia collaborated to develop advanced RF transceiver
solutions for HSPA
DENSO
designed and tested its robotic arms by using NI's measurement
tools
Mitsubishi's
LCD TV with Blu-ray disc recorder employs Marvell's Qdeo chips
Online
video-rich tutorial on DC power supply circuit design from
PI
Digi-Key
to sell Tusonix line of products from CTS
MEMC Electronic
Materials completes the acquisition of SunEdison
Researchers
can access MATLAB on TeraGrid
New Telefónica
HSPA+ network deployed with Sierra AirCard USB 307 modem in
Spain
Microsemi's
high power single-phase rectifier bridge modules are now DSCC
qualified
Mitel
Networks adds Microsemi's PowerDsine to its DataNet portfolio
Atmel
expands its 6-pin AVR Microcontroller family
Motorola
gains push-to-talk advantage by acquiring RadioFrame's iDEN
products
Austriamicrosystem
expands Multi Project wafer prototyping service
CDMA
and WCDMA patent arrangement agreement by MediaTek and Qualcomm
Roti maker,
bone screws, and website security wins Silicon Valley Entrepreneurial
Awards
Dune and
NetLogic validated the interoperability between their products
FormFactor
qualifies one-touchdown 300-mm wafer probe card for DRAM sort
test
Ericsson
announces completion of Nortel's acquisition in North America
EDGE Evolution
software from Ericsson adds 3G capabilities to GSM networks
12
design wins for Continuous Computing's DPI tech from network
equipment providers
YM Krishna
SSK produce renewable energy by employing GE Fanuc's control
system
FlashCORE
III programming solution from Data I/O wins 2009 global technology
Award
Mutare
selects Ditech's PhoneTag automated voicemail-to-text service
Hand gesture
based interface for remote control of TV
Toshiba
to expand use of Cadence tools for SoC design
TowerJazz
and Tanner EDA to deliver PDK for power management IC design
Aptina
did post layout verification of its image sensor design using
Fast 3D software
Toshiba
develops new photoresist tech for 20nm semiconductor fabrication
Toshiba
Semiconductor is transferring its chip assembly facility to
Nantong
Broadcom
supports WAPI in its WLAN ICs
NXP wins
Sanmina-SCI's best supplier award
Agilent's
new 1-Megawatt Solar Power System to save $3.5 million in
energy costs
Symmetry
to distribute Fujitsu's chip in Americas
Hynix Semiconductor's
2Gb DDR3 DRAM devices Validated by Intel
Semiconductor
equipment Book-to-Bill ratio above 1 from Jul to Oct 09
Semiconductor
packaging materials market to reach $20.1 billion by 2013
DRAM test
lab opened in Munich Germany
Cisco and
HP lead in fixed 10 Gigabit Ethernet switch segment
National
Micro. Institute names Powervation as best semiconductor startup
up of the year
Intel
invest to built 1000 times more powerful of current supercomputer
Westcode
Announces New 'Megawatt' press-pack IGBT transistors
Advanced
semiconductor chips at a price of a dollar and less
Semiconductor
revenue to drop by 11.4 percent in 2009: Gartner's reviewed
estimates
Learn about
LabVIEW at NI's conferences in Indian cities
Applied
Materials buys advanced semiconductor packaging expert Semitool
Digital
Imaging achieve first-pass silicon success in 22 days
Intel and
NEC join hands to develop supercomputer technologies
DNP, MPI
and Sony develop smartcard using biodegradable plastics
IP
and patents are the gold reserves of the semiconductor industry
Intel and
AMD race neck to neck in supercomputing domain
IEEE sponsored
HTC workshop discuss challenging technologies
Videocast
to learn techniques of powering Xilinx FPGAs
Over a
billion SoCs integrate flash memory interface IP components
from Arasan Chip Systems
ST Micro's
contactless chips to have NXP Semiconductor's technology
Sigma completes
acquisition of CopperGate Communications
Micronas
and University of Freiburg gets "f-cell Bronze Medal"
innovation award
ABI position
NXP Semiconductor at number one in contactless IC market
Touch
Micro-System employ Rudolph's software to improve yield in
MEMS devices
Silicon
Frontline's post-layout verification tool is validated by
UMC and TSMC
Tanner
EDA partner with SoftMEMS to support chip designers in India
Marvell's
semiconductor innovations in India targets broadband connected
smart gadgets
Element14
launched online resource for Microchip's XLP MCUs
Agilent
and Nexus deliver DDR3 memory bus debug solutions
IO-Link
reference design jointly by Atmel, HMT and MESCO
Cavium
Networks to acquire MontaVista Software
GigOptix
has acquired fables mixed signal IC supplier ChipX
Record
shipment of processor chips in 3rd quarter 2009
India targets
20 giga watts of solar power by 2022, AP leads
A team
formed in Europe to develop capacitors inside semiconductor
chips
Marvell
and E Ink collaborated to develop processors for e-readers
Internet
audio growth to drive demand for Class D and class G/H amplifier
ICs
Mentor
Graphics to unify silicon test and yield analysis
Indian
Telecom market: ITI and Intel right match for growth of wireless
broadband n/ws
ST Micro
and Mayo clinic collaborate on remote patient monitoring technology
Infineon
and TSMC are partnering to jointly develop 65nm embedded flash
process
Realtek
continues to buy Synopsys EDA tools
Elpida
share DRAM technologies with ProMOS in exchange of Foundry
Services
ON
Semiconductor reports 13% sequential growth in revenue in
3rd Q 2009
Semiconductor
revenues to drop by 11% in year 2009: SIA forecast
John Kelly
wins Robert N. Noyce award for his contribution to Semiconductor
Industry
NI Expands
HIL simulation platform for embedded control systems apps
SEMI powers
IC buyers to counter chip counterfeits with new standards
Samsung
stacks 8 32Gb NAND flash dies to form 0.6 mm thick single
device
Market
study says SiC & GaN devices to impact discrete power
semiconductor market
Avago's
critical IP enables Juniper Networks' development of silicon
devices
Newton
selects Broadcom's Bluetooth tech for its MoGo Talk wireless
headset
17% of
growth in silicon wafer area shipments in third quarter 2009
Advantech
supports Windows Embedded CE 6.0 R3 RTOS
SEMI released
database of Opto and LED manufacturers
ST
Micro and LG Display collaboration unveils iDP interface standard
for LCD TVs
Low resistance
tungsten metallization process for semiconductor chip manufacturing
IBM's x
servers employ LSI 6Gb/s SAS technology
Raytheon
awards TriQuint with a 4-Star Supplier Excellence Award (SEA)
FXI
and Atmel develops microSD gaming console for mobile phones
Semiconductor
assembly and test services provider Unisem's 3rd Q revenue
grew by 11.1%
WCDMA power
amplifier from Anadigics powers Samsung's 3G Handsets
Aldec opens
new office in Bangalore, India
SAMSUNG
to collaborate with Microsoft to save energy
Tower
Semiconductor outperforms global semiconductor fab business
Semiconductor
industry's fast recovery in 3rd Q 09 is due to processor and
DRAM demand
Delta Networks
taps Indian telecom and networking equipment market
October 2009
Vishay
Nobel is now a partner of Schneider Electric's CAPP
Jennic
demos low-power ZigBee with the energy harvested from an electro-
mechanical switch
Onzo to
develop consumer displays for Echelon's utility metering services
Widex
employs Mentor's analog/mixed-signal simulators to design
its wireless chips
NVIDIA
adopts Synopsys Yield Explorer to reduce time to volume
Agilent
and Stanford University collaborating to explore new class
of nanoscale devices
Return
path receiver with DOCSIS 3.0 performance from Alloptic
Due
to faulty plastic molding Belkin recall its SurgeMaster surge
protectors
Enablence
sign $3.5 million agreement to develop PLC based components
for NGN apps
Cadence
low power design flow for SMIC 65nm process
Mitsubishi
selects eASIC's Nextreme ASICs for its Display Wall Cube Systems
Trident
adopts Mentor's Veloce platform for system-level verification
of its digital TV SoC
FormFactor
unveils 300-mm TouchMatrix probe card for NAND Flash devices
1
million Mustang EPON ONU chips shipped by TranSwitch
Open
Verification Methodology cookbook from Mentor Graphics' s
Mark Glasser
Indilinx,
Cavium and Narinet collaborated to bring SSD into networking
storage systems
Intersil
and Georgia Institute of Tech joint alliance for semiconductor
development
Intel
and Numonyx achieve stacking of PCM arrays to increase memory
capacity
Microsemi
to close manufacturing facility in Scottsdale, Arizona
15
-20% sequential growth of world's semiconductor revenues in
3rd Quarter of 2009
Aurora
PVIDESKTOP platform from Power-One for Aurora Photovoltaic
Inverters
MEMC
to acquire SunEdison
Sharp develops
35.8% conversion efficient solar cell by using triple-junction
compound
Cray
adopted Denali's Databahn PCIe 3.0 controller core and PureSpec
verification IP
Intrinsyc's
Windows Embedded CE 6.0 R3 with CerfBoard 270 reference designs
ST adopts
ARM Cortex-A9 MPCore processor for its home entertainment
equipment
BSNL
connectivity, HCL computers and Intel chips and tech; a powerful
combination
NXP
and Avni collaborate to develop LED based street lighting
solutions for India
Open-Silicon,
MIPS and Virage Logic achieves 65nm ASIC processor design
Medical
electronics firms employ advanced Bluetooth to access patient
data wirelessly
National
Semiconductor adds more distributors for its PV solar solutions
Circuit
Emulation products from Zarlink semiconductor wins MEF 18
certification
LSI and
Supermicro collaborates to offer end-to-end 6Gb/s SAS solutions
Carrier
Grade QuickSec 5.0 toolkit integrates Cavium Networks OCTEON
and Multi-core support
ARM
and Mentor collaborates to support Nucleus RTOS/Graphics software
CoWare
partners with ARM to provide AMBA Network Interconnet based
SoC designs in SystemC
Cadence
and ARM joining hands to develop SoC design flow
Ericsson
and Samsung working together to make their LTE devices and
networks interoperable
E Ink and
Freescale are partnering to develop embedded processors for
eBook market
Aeroflex
/ Metelics wins DSCC Certification for their small signal
zener diodes
Ixia
to acquire Agilent's N2X Data Networks Product Line
Novatek
licenses the MIPS32 24KEc processor to power SoC designs for
digital home
NIST adopted
CableLabs SMA specifications for its Smart Grid networks
TSMC opts
for Mentor's Calibre physical verification platform for its
Integrated Sign-off Flow
Single-chip
STi5197 cable STB decoder IC from ST Micro is opted by Chinese
STB vendors
Methanol
fuel cell based external power source from Toshiba for mobile
devices
Semiconductor
revenue update: a bit of motivating figures
New Mobile
Memory Initiative with breakthrough power efficiency from
Rambus
European
research project "BioP@ss" aims to develop electronic
ID card in chip card format
ADT security
services is the new member of Z-Wave Alliance
New ALR-9900-EMA
reader from Alien deploys EPC Gen 2 RFID solutions
SP AusNet
select Motorola's mobile broadband tech to power WiMAX-based
smart metering apps
Extreme
Networks and Motorola collaborates to provide secure, fast
802.11n services
SAMSUNG
Electronics' TV chip for North American mobile digital TV
Newark
to sell, support and stock austriamicrosystems' Analog ICs
CTS wins
$22 million production program from Japanese automotive manufacturer
Cavium's
processor powered TeamF1's security gateway drives Netgear's
VPN firewall
MontaVista
now supports 4G wireless networks with OpenSAF capabilities
Novellus
unveils SABRE Excel platform for 22nm copper electroplating
MagnaChip
offers 0.11um, 30V process technology with small SRAM cell
size
Octasic's
enhanced Vocallo MGW multicore processors support advanced
video features
Logic
Devices is sampling its first DDR2 DRAM modules
TriQuint
wins $16.2M DARPA contract to develop GaN circuits for defense/aerospace
UMC completes
EPD verification for its 200mm IC wafers
Joint collaboration
enables ARM processor and intrachip bus IP on Xilinx FPGAs
New China
website launched by Exar
Cochlear
and NXP collaborates to design Cochlear's Hearing Implant
devices
Cray selects
Gennum's Snowbush PCIe 3.0 PHY IP for its supercomputer design
NXP
Semiconductor and Infineon are sharing much of the ePassport
market pie
GLOBALFOUNDRIES
picks Mentor for IC manufacturing related EDA software
BittWare
Receives Production Order for NG STARLite Program
Wind River
VxWorks MILS Platform 2.0 for GE Fanuc's single 3U VPX computing
platform
GE Fanuc
secured $1 million order to upgrade Northrop Grumman's IAS
Pace Embedded
Systems Lab at R.V. College of Engineering, Bangalore India
SMIC extend
its 45nm CMOS technology to 40nm and 55nm
Qdeo video
processors from Marvell win 2009 TV Innovation Award
New standard
from SAE to enable Ethernet for critical embedded systems
Audi's
car audio systems powered by NXP's HD radio chips
Joint hardware
and software platform for IPTV over broadband network
New memory
cards from Samsung Electronics are introducing in this month
at Taiwan
Quanta
selects Tilera's 64-core processor for cloud computing
IBiquity
selects Atmel's AVR Microcontrollers for HD radio reference
design platforms
New Innovation
to boost efficiency of fuel cells from MIT team
LG Electronics
implements Rayspan's metamaterial antenna in its mobile phones
Aeroflex
adds new LTE measurement capabilities to its PXI platform
Marvell
supports new "Wi-Fi Direct" standard for 802.11
WLAN devices
AMIMON
employ Sidense's OTP tech in chips used for WHDI
GigOptix
now shipping pre-production quantities of 40G EO polymer modulators
Sigma Designs
to acquire CopperGate Communications
Notebook
and netbooks propel Intel back into growth path
Aeroflex
3280A spectrum analyzers added with 30 MHz digital demodulator
at no extra price
Infineon
maintains number one position in Chip-card semiconductor market
Mentor
Graphics to acquire PCB manufacturing software vendor Valor
IPTV set-top
box from Amino now powered by Intel Atom based CE4100
TSMC-qualified
Electromagnetic simulator from Agilent for RF design in 65
nm process
Instat
says GPS enabled phones to capture PND market opportunities
NXP Semiconductor
and Virage Logic go for a long-term give and take relationship
Joint strategic
initiative from AMD and CyberLink to accelerate CyberLink
apps
Allegro
MicroSystems phasing out its wafer fab operations by mid-2012
Incap plans
to extend its design unit in India
Radio platform
streaming new-gen Internet content from Ensigma and Imagination
Tech
Researchers
getting closer to integrating nanowires on CMOS semiconductor
chips
Fresco
are Entropic are partnering to develop hybrid receivers for
modern TVs
UMC Fab
12i migrates its manufacturing process to 45/40nm
Microsemi
wins $2 million contract to develop SiC RF components for
Avionics apps
Joint RF4CE
development platform from TI, C.G. Development and Quanta
Echelon
and Eaton collaborate to provide Smart Grid solutions in homes
Joint strategic
initiative from AudioCodes and BroadSoft for IP voice network
solutions
ST Micro's
first-pass silicon success by utilizing Synopsys DesignWare
solutions
Cavium's
NITROX PX security adapters deployed in Hitachi's blade server
systems
Elpida
memory completes the development of the 40nm 2-gigabit DDR3SDRAM
GE Fanuc
deploys NVIDIA graphics processing units (GPUs) on its new
hardware products
JDSU shipped
more than 100 Q Series UV lasers for the scribing of LED wafers
NREL adopted
Synopsys' Sentaurus TCAD to simulate solar cell performance
Dongfeng
employs MathWorks tools to design hybrid-vehicle battery system
More than
8,000 instrument drivers through Instrument Driver Network
from NI
DSCC qualification
granted to Microsemi's SMT power schottky diodes
Novellus
extend SPEED Max STI manufacturing process to 32nm technology
node
Dialog
Semiconductor's ICs to power-manage NEC's multimedia processors
ORBCOMM
selects Sierra Wireless for its M2M web services platform
Philips
IntelliVue Patient Monitors wins Aruba's interoperability
certification
Enel selects
ST Micro chips for its electronic power meters
Premium
Wi-Fi Service jointly by Qualcomm and Wandering
Joint AUTOSAR
3.0-compatible solution from NEC Electronics and KPIT Cummins
Freescale
and ST Micro together launched 32-bit MCU for automotive electronics
Trident
acquires NXP Semiconductor's TV and STB IC business in exchange
of Trident's stocks
PERC Java
virtual machine supports BeagleBoard for real time embedded
systems
Quatech
acquires Socket Mobile's SocketSerial devices business
0.18 micron
CMOS process from ON Semiconductor for digital and mixed-signal
ASICs
Eurotech
received $1.8 million order from Cadec for fleet management
embedded tech
PDK for
GaAs pHEMT and HBT process from AWR and WIN semiconductor
Microsemi
joins PoE technology consortium
'Common
Platform Technology' qualifies Synopsys IC Validator for 32-nm
design rule
Broadcom's
Wi-Fi reference designs are selected for the Wi-Fi CERTIFIED
n Test Bed
Panasonic
and Renesas collaborating on 28-32nm SoC process tech at Renesas
Naka site
Jade graphics
chip from Fujitsu powering 'virtual image' cluster of Jaguar
Range Rover
McObject's
eXtremeDB embedded DB software is selected by defense/aerospace
industry
Accellera
approves an interoperability guide helping design re-use of
IP components
Joint development
of LTE based mobile-terminal platform
CTS to
supply throttle position sensor to one of the India's leading
motorcycle maker
Sierra
Wireless integrates Anyware Tech to enhance its M2M solution
capabilities
Radiocrafts
and Sierra Wireless jointly launches gateway for smart meters
September
2009
Pyxis Technology
gets 3 million funding from four different VCs
Availability
OF CMD made 65xx microprocessor replacements by WDC/DEMA
ADI Blackfin
DSP to power UTAS patient monitoring systems
IR's DC-DC
Converter IC ART2815T is on-board Planck spacecraft
New standard
to emerge for streaming digital media content on TVs from
mobiles
Supermicro
Launches AMD Istanbul based server, blade, and workstation
computers
TriQuint
Semiconductor focusing more on broadband connectivity enabling
devices
Samsung
producing 512-Megabit nonvolatile memory PRAM
TranSwitch
gaining design wins in Asia for its Atlanta communication
processors
Kyocera
is strategically investing in sales and divesting its Indian
R&D resources
Enea's
OSE multicore edition RTOS supports Cavium's OCTEON plus processor
family
TSMC to
make AMCC' power architecture based processors on bulk CMOS
process
Physically
active but shy girl-robot from Murata
Qosmos
ixEngine to support Tilera multi-core processors
DIP International
to sell Octasic chips in Europe
TSMC to
produce Fujitsu's semiconductor chips at 28nm process node
New Scale's
ASICs are now sold by austriamicrosystems
Sony has
sold 1 million PlayStation3 gaming systems in 3 weeks
CTS is
the EMS partner for manufacturing Thales' defense electronic
products
Advantech
supports Moblin OS with fast boot funtion
Cypress
Semiconductor's LED controller chips inside WAC's LED light
system
Altera
started shipping 40-nm Stratix IV GX FPGAs
Sony selects
Marvell's video processor to power its Blu-ray Disc MegaChanger
General
Motors and Reva partnership to enhance Indian automotive electronics
market
ARM Cortex-M3
based ZigBee development and debugging platform for Embedded
apps
Phoenix's
Hyperspace aligned with Moblin v2 Technology for Intel Atom
based devices
Intel Atom
developer program for ISVs and developers targeting netbooks,
mobile apps
Microsoft
Windows 7 Touch Logo now certifies SiS capacitive touch panel
controller
TNT Innight
embarks on major RFID field test with NXP and IPEX Group
X-FAB adopted
Agilent's IC-CAP device modeling platform for DC and RF apps
Mantaro
partners with Tilera to develop their services for high-end
computing solutions
IR to display
its new power management solutions at CEATEC JAPAN 2009
LSI demonstrates
single-root I/O virtualization solution at Intel Developer
Forum
Semiconductor
industry is cautiously optimistic on next phase of growth
Semiconductor
chip based authentication to prevent cloning of e-gadgets
IBM's on-chip
DRAM prototype technology achievements
New Firmware
Catalog for Actel's embedded processor development tool suite
Intel's
Design Expo to bridge mobile technology for student designers
Microsoft
Windows Embedded CE 6.0 R2 training course by Atmel and Adeneo
PV Group
forms new standards committees in Japan and Taiwan
Huawei
to procure Triquint's optical driver amplifiers for it optical
transport system
NXP and
Skymeter are partnering to offer road-use metering technology
Paul Grimme
is now VP and GM of ST's automotive products
Nanotech
based battery innovation by MIT scientists for bigger and
longer storage
CAP-XX
study compares white LED flash with Xenon
UMC audits
carbon footprint for its IC wafer production facility
Microchip
offering exchange programs for your old MCU development tools
HyperSpace
OS is to be bundled with Intel Atom based motherboards
Quadros
to ship ARM RealView dev. suite with RTXC RTOS and integrated
software
Flash download
option for J-Link from SEGGER for free
IR's radiation
hardened DC-DC converter is used in Planck spacecraft
Moser Baer
is quickly gaining share in USB flash memory market
DDR3 based
threaded module prototype for multicore computing
Agilent
Technologies is rated as best place to work in a survey
AT&T
and Intel collaborate in providing remote system admin services
to SMEs
Open standards
for manufacturing masks used in semiconductor equipment
Panasonic
developed a robot becoming either a bed or wheelchair
Wind River's
MIPS architectures complies with Carrier Grade Linux 4.0 specs
Wipro ranked
as number-one semiconductor global R&D service provider
Digi-Key
signed a global distribution agreement with XMOS
Blackfin
based IP media development kit jointly developed by ADI and
Arcturus
ZTE selects
LSI SP2600 media processor solution for wireless applications
Synopsys
has added Sunplus to its list of customers called 'primary
EDA partners'
Peregrine
Semiconductor records a shipment of 500 million UltraCMOS
RFICs
Microsemi's
radiation hardened medium power transistors gets DSCC qualified
Cypress
embed ARM cores in new version of PSoC devices
Good news
for embedded system designers with expertise in PSoC and ARM
Samsung
adopting Skyworks' RF front-end devices to power its 3G mobile
handsets
Agilent's
expands its serial J-BERT N4903B for 16x fibre channel transceiver
testing
Fujitsu
is now shipping SAW filter-less 3G transceiver for mobile
phones
TSMC characterizing
its sub-40nm memory IP with Synopsys HSIM simulator
Computation
capability enhanced Matlab and Simulink support multi-core
systems
India UK
Semiconductor handshake; where it can be strong?
Atheros
to acquire Intellon to expand its network device domain
Entropic
and ViXS Systems joined to develop MoCA enabled, NAS reference
design
Myriad's
homescreen widget solution for low cost mobile phones
iSMART's
high-speed DSM L3 range and speed-multiplying technology
ST's Demonstrator
platform for hybrid broadcast and broadband set-top boxes
ADI's blackfin
is selected by Rigol to power its oscilloscopes and spectrum
analyzers
Broadcom
and SoftAtHome partnering on hybrid-IP set-top box solution
Ramtron
settles product defect claim of its memory product
Marvell
lauds China opportunities for its future growth
Micrium's
Jean Labrosse written a new book on uC/OS-III Real-Time Kernel
Fujitsu
selects AMCC's QT2225, a dual port XAUI-to-10GBASE-KR PHY
IC
Network
Equipment Technologies selects Wintegra's UFE3 for its multi-service
platform
Popular
solar industry event Intersolar to happen in India
Sanmina-SCI
and OneChip Photonics are partnering to manufacture optical
PICs
Freescale's
new unified common platforms enable 3G to support LTE and
other 4G standards
New consortium
to drive automotive DSI bus standard for automotive electronics
Zarlink's
VE880 chipset powers Gigaset mobile convergence product
Shift in
semiconductor fab business model impacts semiconductor chipmakers
Ready reference
design for residential-gateway middleware from Jungo and Broadlight
Popular
solar industry event Intersolar to happen in India
Sanmina-SCI
and OneChip Photonics are partnering to manufacture optical
PICs
Freescale's
new unified common platforms enable 3G to support LTE and
other 4G standards
New consortium
to drive automotive DSI bus standard for automotive electronics
Zarlink's
VE880 chipset powers Gigaset mobile convergence product
Shift in
semiconductor fab business model impacts semiconductor chipmakers
Synopsys
offers EDA software license to IIT Kharagpur through its Charles
Babbage Grant
LSI and
Aricent extends their collaboration to next-generation wireless/wireline
networks
Jointly
developed/tested technical specs for value-added IMS network
services
New AUTOSAR
3.0-compatible solution for various hardware platforms
SPMT's
abridged technology specifications for mobile devices
Cash rich
ATIC acquiring Chartered to accelerate growth in semiconductor
world
Isuppli
predicts >50% growth for 5 of the top 10 solar semiconductor
suppliers
Tilgin's
TR-069 with Amino's IPTV set-top boxes (STBs) for triple play
home solutions
Aruba's
FIPS 140-2 validated 802.11n solution for secure wireless
networking apps
Dow-Key
Microwave receives GOLD supplier award from Northrop Grumman
New software
framework for embedded platforms from Eurotech
Barco's
JPEG 2000 IP core supports 40nm FPGA platforms
Zarlink
and Tollgrade combined test solution to improve triple-play
service reliability
Samsung's
LCD HD panels are powered by NXP's PNX5120 video co-processor
Humax picks
Broadcom's BCM3556 DTV SoC for its DVB based platforms
TriQuint
acquires TriAccess to offer devices capable of triple-play
services
64% growth
in fab spending predicted by SEMI's world fab forecast
Semiconductor
companies realizing the potential of Indian SMEs in non-metros
Broadcom
continue to have a strong hold on high-speed Ethernet devices
Windows
7 based windows embedded software available for downloading
Microchip
selects Kolkata for it's embedded designer forum event in
India
Kontron
AG opened new sales and support offices in India
Zarlink's
VE890 Chipset to link with AudioCodes' Tulip AC494/5/6 ATA
Smartbook
was the top attraction at Freescale Semiconductor's event
in Bangalore
European
co-operative effort called IMPROVE to advance semiconductor
manufacturing
Sony to
transfer its US LCD manufacturing assets to Hon Hai
August 2009
BFi OPTiLAS
to distribute Melexis products in Europe
Approved
C-coded embedded software from Tata Elxsi for Tensilica's
DSP ConnX D2
Synfora
acquires SoC design tool Esterel Studio from EstrealEDA Technologies
Murata
takeover Panasonic's multi-layer ceramic capacitor business
FlexRay
is gaining ground as an accepted automotive bus interface
LSI retained
its top position in Host Bus RAID Controller market with further
growth
ZF Electronics
TVS to sell CTS' components in India
Fluke Networks
has acquired WLAN security specialist AirMagnet
Cryptography-Research
locking Atmel's microcontrollers against DPA attack
No quarterly
surprise for semiconductor market
Ramtron
secures $6 million credit from Silicon Valley Bank
Conexant
has sold its broadband access product lines to Ikanos
Airmagnet
say Cisco's WLAN AP can be skyjacked
Microsemi
sold the assets of Semicoa to settle US DOJ Suit
Taiwan
semiconductor fabs showing more love towards sun and light
Formation
of world's 3rd largest semiconductor company is postponed
till Sept 09
IR quarterly
sales revenue up by 16.2%
Renesas
picks Synopsys Proteus OPC for 45-nm node production
e2v to
present ASIC design paper at Eurosensors Conference
A new M2M
solutions JV named nPhase by Verizon Wireless and Qualcomm
New EMI
test receiver with a frequency range upto 7 GHz from R&S
8.5 GB
DVD media launched by the Moser Baer
NEC Electronics
licenses HD technology from DivX
Slight
increase in quarterly revenues of Analog Devices in 2Q09
Jazz Semiconductor
replacing GaAs RF component process with SiGe process
GE and
Fanuc decide to separate their long time industrial systems
JV business
Core Logic
licensed ARM Mali-400 MP GPU targeting high-end portable devices
New software
version 1.7.6.2 for Aeroflex 3900 series digital radio test-set
Kyocera
opens sales office in Gurgaon, India
austriamicrosystems'
MEMS microphone analog IC records 1billion shipments
Infineon
again lead in the discrete power semiconductor market
IBM researchers
use DNA to assemble nano-switching devices on a semiconductor
chip
Wafer probe
card from FormFactor has achieved more than 15 million contacts
cycles
Entropic
is demonstrating UPnP at CableLabs Conference
PyCells
studio of Ciranova crosses 1000 downloads
New software
framework from Aricent for multimedia rich consumer devices
Parvus
designed computers on-board Excalibur UAV
Tata BP
Solar and NXP partnering to develop products by using combined
technology
National
Instruments and SolidWorks jointly offering solutions for
mechanical design
Infineon's
wireline division acquired by Gloden Gate Capital is named
as LANTIQ
Rohde &
Schwarz enters broadband amplifier market
Microsemi's
radiation-hardened MOSFETs granted space-level qualification
IDT goes
fablite by passing the chip fabrication work to TSMC
High bandwidth
PXI Digitizer jointly developed by NI and Tektronix
Toshiba
is shipping 43nm NAND flash in volumes to laptop OEMs
Advantech
receives class 1, division 2 certification for industrial
Ethernet switches and media converters
Amino's
A130M HD set-top box wins TMC 2009 IPTV Excellence Award
Cosmic
Circuits appoints Jose-Maria Moniz as Vice-President Worldwide
sales
Intersil
gained a key noise killing technology by acquiring California
based Quellan
79% quarterly
growth in silicon semiconductor wafer shipments in 2Q09 but
not yet crossed 2Q08 mark
CUIs
wall plug and desk-top power supplies now sold under it's
V-Infinity division
Amid heavy-loss
Panasonic's semiconductor and devices revenues up by 25% on
q-o-q basis
Huawei
picks LSI's media processor chip SP2600 for its telecom infra
systems
Intel's
new idea to tap severely unused processing power
Spice-
a-circuit 1000 times faster by using behavioral modeling tool
Arana from Orora
Entropic's
TV and STB tuner ICs are made at Jazz Semiconductor's RF CMOS
fab
No major
change in Wi-Fi certification program after IEEE802.11n draft
approval
July 2009
VMware
inaugurates new development center in Pune, India
TSMC springing
back to better days of semiconductor manufacturing
Signs of
semiconductor industry's recovery to slow growth is seen in
2nd quarter of 09
ST Micro
and Infineon's Q2 sales figures says semiconductor market
is slowly growing
Teradici
selects Synopsys' Galaxy and Discovery chip design tools
ARM Q2
revenue report indicate weak microcontroller, processor and
semiconductor IP market
Austriamicrosystems
to make Triad Semiconductor's 32-bit processor based SoC chips
ARM, Chartered,
IBM, Samsung, and Synopsys joining hands to develop next level
32/28nm Mobile SoCs
NEC and
Renesas merging process is time delayed by 1 month
IDT powered
by Tundra's expertise is allying with Micron to develop PCIe
SSDs
Broadcom
broadening the use of Bluetooth
IC Validator
from Synopsys supports TSMC's new design verification format
Mentor
makes it's range of EDA tools to support new TSMC processes
Moser Baer
and Philips settle a patent dispute
IC supporting
environment and money saving mobile phone charging adapters
Semiconductor
revenues from WiMax based Micro, Pico and Femtocells to grow
at 260%
Q&A:
The increasing role of FPGA in embedded systems and latest
trends
Interoperable
Process Design Kit jointly developed by Synopsys and TSMC
Slight
growth in semiconductor equipment booking
Actel FPGA
on-board NASA Lunar spacecrafts
Fujitsu
Micro selects Digi-key to sell it's MCUs and other parts
Volterra
Semiconductor 2Q revenue figures signals industry recovery
Trusted
Logic and NXP semiconductor partner to sell bundled NFC solutions
New LTE
handset certification platform from Aeroflex and w2bi
EU and
Japan customers help KPIT Cummins to register a quarterly
profit growth of 73%
Semiconductor
can drive recession out but not vice-versa
Intel completes
the process of Wind River acquisition
UL now
has a new lab facility for solar testing in North America
STMicroelectronics
formally launched Nano2012 research and development program
Magma's
Talus based low-power reference flow available for SMIC 65-nm
libraries
BSNL awarded
US$77 million contract to Sterlite for building FTTH network
Bluetooth
SIG is conducting Bluetooth application design contest
EDA industry
revenues down in 1Q09 in all areas except Asia-Pacific
MediaTek
and Samsung employ ARM's Mali in their chips and devices
Ericsson
completes delivery of new GSM base station hardware to VodaFone
Essar
Embedded
and portable electronics saying bye bye to Intel x86 architecture
Sumitomo
employs Stratix IV GX FPGAs in its LDPC system
Nanotechnology
researchers at Berkeley Lab demo a low cost and flexible solar
PV cell
Broadcom
gave up the pursuit for Emulex
India;
the blooming garden for semiconductor industry
Infineon
sells its wireline communications business to U.S. Investor
Golden Gate Capital
NXP's RFID
chips and expertise tapped by Siemens for its pharmaceutical
RFID sys
Philips
interoperability test lab designed for testing of digital
consumer systems' connectivity
Lab-on-chip
VereFlu of Veredus Lab is successfully tested on Swine-Flu
H1N1 samples
Peregrine
Semiconductor and MagnaChip completed the qualification of
UltraCMOS technology transfer
Achived News (Jan to June
of 2009)
Achived News (2008, 2007, 2006)
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