Date: 30th July 2010
New DDR3 memory controller interface for
consumer electronics from Rambus
Rambus has announced a high-performance, low-cost DDR3
memory controller interface solution tailored for consumer
electronics. Rambus says that this DDR3 solution is the
first to demonstrate operation in working silicon at a data
rate of 1866megatransfers per second (MT/s) in a wire bond
package.
Rambus offers its DDR3 memory controller interface solution
to its licensees as a PHY development package (PDP), which
allows memory interface designers to customize their DDR3
implementation for their specific application. Rambus' DDR3
interface solution PDP includes all the necessary building
blocks, PHY architecture, schematics, models, generic layout,
floor plan, verification IP, implementation documentation,
testing documentation, design scripts and simulation files,
to ensure design success.
"Our licensees benefit from Rambus' patented innovations
and leading design expertise in a silicon-proven DDR3 interface
solution they can customize to their needs," said Sharon
Holt, senior vice president of Licensing and Marketing at
Rambus. "This high-performance DDR3 solution tailored
for wire bond packaging is ideally suited for a broad range
of consumer electronics including next-generation HDTVs,
digital set-top boxes and Blu-ray players and recorders."
The DDR3 interface solution builds on Rambus innovations
such as:
1. FlexPhase circuits for optimum memory system timing.
2. Output driver calibration, which supports high data rates
and improved system voltage margin.
3. On-die termination calibration for improved signaling
environment.
4. LabStation software for rapid bring-up, characterization
and validation.
Rambus also offers its licensees engineering services such
as package design, system board layout, statistically based
signal and power integrity analysis, reference guidelines,
and bring-up assistance.
For more information visit: www.rambus.com.
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