ST32-M SIM card IC family from ST
Micro for M2M cellular connections
ST Micro has announced the ST32-M IC family, a low-power
processor chip that manage SIM data for machine-to-machine
(M2M) cellular communications.
The ST32-M IC family combines the processor architecture
and high-density low-power embedded-Flash memory, enabling
machines to connect to cellular networks and communicate
automatically. The M2M applications include automatic utility-meter
reading, retail systems, such as replenishment monitoring
for vending machines, security equipment; and asset-management
systems.
ST Micro says, applications that use M2M capabilities include
the European eCall road-accident alert system, planned for
launch in 2010, which allows vehicles to automatically inform
rescue services of the location and details of an accident.
A growing market that could account for over 200 million
mobile connections by 2013, according to an August 2009
report by Beecham Research.
The key features of the ST32-M IC are,
32-bit ARM Cortex-M3 CPU
512-KByte or 416-Kbyte Flash with 12-Kbyte RAM
320-KByte or 256-Kbyte Flash with 8-Kbyte RAM
1.8 V, 3 V and 5 V Vcc range
CPU clock of 15 MHz typical
Extended cycling, 500 kcycles/page or 50 Mcycles/sector
Extended data retention of 10 years at 105 °C or 15
years at 85 °C
"The ST32-M family complements the ST32 range, targeting
classical Java SIM card ICs, and the ST33 family, for the
highly secure SIM card market," said Laurent Degauque,
Telecom and NFC marketing manager, Digital Secure Access
(DSA) Division, STMicroelectronics. "These three families
have 90nm embedded Flash technology and the ARM Cortex™-M3/SC300
core in common, and therefore provide customers with the
ability to leverage Java OS development across a wide range
of applications. In addition, the extended Flash cycling
capabilities of the ST32-M family, when combined with application-specific
software development, will allow Mobile Network Operators
to achieve multi-million data cycles in harsh environments."
Operating temperature range: -40 to 105 °C
Package: DFN8 6 x 5mm package
Availability: Sampling in Q4 2009 and mass production is
expected to begin in Q1 2010
For more details visit www.st.com
Editorial Product Rating: Average
